Thermal management device for an integrated circuit

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United States of America Patent

APP PUB NO 20050111188A1
SERIAL NO

10723533

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Abstract

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Embodiments of the present invention include an apparatus, method, and system for an electronic assembly with a thermal management device including a porous medium.

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Patent Owner(s)

Patent OwnerAddress
WEGENER COMMUNICATIONS INC11350 TECHNOLOGY CIRCLE DULUTH GA 30097-1502

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bhattacharya, Anandaroop Phoenix, AZ 17 195
Garcia, Jerome L Chandler, AZ 3 25
Prasher, Ravi S Tempe, AZ 15 196
Prstic, Suzana Chandler, AZ 11 132

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