Device, with electrospun fabric, for a percutaneous transluminal procedure, and methods thereof
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United States of America Patent
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Issued Date -
May 26, 2005
app pub date -
Jun 22, 2004
filing date -
Nov 20, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention relates to an occluder for a percutaneous transluminal procedure. In one embodiment, the occluder includes an overall support structure and a plurality of occlusion shells connected to the overall support structure. At least one occlusion shell includes an electrospun fabric.
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