Pick and place machine with improved component placement inspection
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United States of America Patent
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Jul 14, 2009
Grant Date -
Jun 2, 2005
app pub date -
Oct 21, 2004
filing date -
Nov 4, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
Embodiments of the present invention improve upon component level inspection performed by pick and place machines. Such improvements include using a position sensitive device that measures the position of the placement head relative to the workpiece as the placement head travels towards and away from the workpiece during a placement cycle. The output of this sensor is used to selectably trigger the acquisition of the images used to measure a placement characteristic of the component placement machine.
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