Method of manufacturing semiconductor device and system of manufacturing semiconductor device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
May 16, 2006
Grant Date -
Jun 2, 2005
app pub date -
Oct 26, 2004
filing date -
Oct 27, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of manufacturing a semiconductor device is provided. A semiconductor module is prepared which has a wiring board and a plurality of semiconductor chips mounted on a first face of the wiring board. The semiconductor chips overlap a central region of the wiring board and an edge region of the wiring board surround the central region. An adhesive tape is located opposite the first face of the wiring board, followed by sticking the adhesive tape to the semiconductor module by a roller. Thereafter, the resulting semiconductor module is cut from a second face side of the wiring board to yield the device. The roller has a central portion and two end portions. The central portion presses the adhesive tape from above the central region. The end portions press the adhesive tape from above the two end regions.
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