Method for forming MEMS grid array connector

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20050120553A1
SERIAL NO

10731213

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for forming a connector including an array of contact elements includes forming a support layer on a substrate, patterning the support layer to define an array of support elements, isotropically etching the support elements to form rounded corners on the top of each support element, forming and patterning a metal layer to define an array of contact elements where each contact element includes a first metal portion on the substrate and a second metal portion extending from the first metal portion and partially across the top of a respective support element, and removing the support elements. The contact elements thus formed each includes a base portion attached to the substrate and a curved spring portion extending from the base portion and having a distal end projecting above the substrate. The curved spring portion is formed to have a concave curvature with respect to the surface of the substrate.

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Patent Owner(s)

Patent OwnerAddress
EPIC TECHNOLOGY INC80 GILMAN AVE SUITE 2E CAMPBELL CA 95008

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Brown, Dirk D Mountain View, CA 15 1253
Radza, Eric M San Jose, CA 3 177
Williams, John D Campbell, CA 81 1090

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