Die extender for protecting an integrated circuit die on a flip chip package
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United States of America Patent
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N/A
Issued Date -
Jun 16, 2005
app pub date -
Dec 16, 2003
filing date -
Dec 16, 2003
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A semiconductor package is provided including a substrate, an integrated circuit die, and a die extender disposed on the substrate around the die. The die extender protects the die from damage. The die extender is typically at least as thick as the die. In addition, the die extender may frame the die. The thickness of the die extender may be such that a heat sink device applied to the package contacts the die extender prior to contacting the die. The die extender may or may not be in contact with the die.
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