Inverted J-lead for power devices
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United States of America Patent
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Dec 15, 2009
Grant Date -
Jun 16, 2005
app pub date -
Dec 9, 2003
filing date -
Dec 9, 2003
priority date (Note) -
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status (Latency Note)
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Abstract
A semiconductor package includes a lead frame having a plurality of leads and a lead frame pad, the lead frame pad including a die coupled thereto, at least one of the plurality of leads having an external portion sloped upwards relative to a bottom surface of the package, metal connectors connecting the die to the plurality of leads, and a resin body encapsulating the die, metal connectors and at least a portion of the lead frame.
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