Stack package with improved heat radiation and module having the stack package mounted thereon
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United States of America Patent
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N/A
Issued Date -
Jun 23, 2005
app pub date -
Dec 10, 2004
filing date -
Dec 17, 2003
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A stack package with improved heat radiation capability and a module having the stack package mounted thereon are provided in which the back surfaces of first and second chips are exposed through the bottom and top surfaces of the stack package, allowing improved heat radiation capability as well as reduced thickness of the stack package. A heat sink may be attached to the stack package for increasing heat radiation capability. A solder bonding portion may be formed between the stack package and a module substrate, establishing good solder bondability between the stack package and the module substrate.
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