Chip assembly with glue-strengthening holes
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United States of America Patent
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N/A
Issued Date -
Jun 23, 2005
app pub date -
Dec 18, 2003
filing date -
Dec 18, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A chip assembly with glue-strengthening holes includes a substrate, a heat-dissipating plate and glue. A chip is arranged on the substrate. The heat-dissipating plate is made of a metal material. The heat-dissipating plate has a peripheral frame projected from a bottom thereof and a plurality of holes correspondingly formed on the peripheral frame. The heat-dissipating plate is covered on the chip. The glue is pasted between the peripheral frame of the heat-dissipating plate and the substrate, so that the glue is filled in the holes of the heat-dissipating plate for generating a griping strength.
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