Importance

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Abstract

A thermoelectric module comprises an upper insulating substrate and a lower insulating substrate; an upper electric circuit metal layer and a lower electric circuit metal layer bonded respectively to the surfaces of said insulating substrates which are positioned face to face; an upper blast stopper layer and a lower blast stopper layer fabricated respectively on said electric circuit metal layers; an upper bonding layer and a lower bonding layer fabricated respectively on said blast stopper layers; and a plurality of -shaped elements consisting of a pair of the P-type semiconductor element and N-type semiconductor element which are fabricated between said upper and lower bonding layers and are electrically connected in series through said upper and lower blast stopper layers.

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First Claim