Importance

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Abstract

A Peltier module comprising a plurality of thermoelectric semiconductor elements between substrates in connection with electrodes. It is manufactured by four steps, namely, an application step in which a resist onto the substrate, a hollow formation step in which the resist is deformed into a resist pattern having a lattice-like shape and a plurality of hollows, an electrode formation step in which the electrodes are formed in the hollows of the resist pattern, and a removal step in which the resist pattern is removed from the substrate, wherein the resist is made of an acrylic resist including acrylic polymer, multifunctional acrylate, and photosensitive agent. The electrodes are formed and arranged by use of the resist pattern having the hollows in such a way that an aspect ratio D/S, which is defined using an electrode thickness D and an inter-electrode space S, is set to 1.25 or more.

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First Claim