Method and device for processing fragile material

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United States of America Patent

SERIAL NO

10507325

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Abstract

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Setting in advance an absorptance of a light L (for example laser light) of a brittle material W to be processed, an absorptance of a plate-shaped sample S of the same material as the brittle material W to be processed is calculated using that set value of absorptance, a thickness of the tabular sample S when that sample S is irradiated by the light L having a same wavelength as that irradiated onto the brittle material, and based on this calculated value of absorptance, and the actual absorptance data obtained by the actual irradiation of the light L on the sample S, a light wavelength that is selected appropriate for the absorptance of the brittle material to be processed is selected, and processing of the brittle material W is carried out using light of the selected wavelength.

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Patent Owner(s)

Patent OwnerAddress
MITSUBOSHI DIAMOND INDUSTRIAL CO LTD2-12-12 MINAMI-KANEDEN SUITA-CITY OSAKA 564-0044
NAGASAKI PREFECTURAL GOVERNMENT2-13 EDO-MACHI NAGASAKI-SHI NAGASAKI 850-8570

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Eda, Tatsuo Osaka, JP 3 33
Morita, Hideki Nagasaki, JP 138 634
Otsu, Yasuhide Osaka, JP 3 33

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