Heated and cooled vacuum chamber shield
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United States of America Patent
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app pub date -
Jan 4, 2005
filing date -
Mar 17, 1997
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention is directed to method for processing substrates and chamber for the same. In one embodiment, a method for processing substrates includes transferring a substrate to a substrate support disposed in a processing chamber, controlling a temperature of a liner lining a sidewall of the processing chamber, and processing the substrate in the processing chamber.
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