Package sealing method, manufacturing method of electronic device modules, sealing apparatus, and packaged product
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
N/A
app pub date -
Jul 6, 2004
filing date -
Mar 10, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
According to the present invention, a case housing a product and a lid made of material that transmits a laser beam are fixed to each other with a bonding member interposed between them, and thereafter, a laser beam is focused onto the bonding member through the lid so that the bonding member is melted. By doing so, the case and the lid are welded together via the bonding member.
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Family
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Cited Art Landscape
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