Heat-curable eproxy resin composition
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United States of America Patent
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N/A
Issued Date -
Jul 21, 2005
app pub date -
Dec 2, 2004
filing date -
May 3, 2002
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention relates to compositions containing at least one epoxy resin A with on average more than one epoxy group per molecule; at least one epoxy adduct B with on average one epoxy group per molecule; at least one thixotropic agent C, based on a urea derivative in a non-diffusing support material; and at least one curing agent D for epoxy resins, which is activated by an increased temperature. According to preferred embodiments, the invention also relates to compositions containing at least one core-shell polymer E and/or filler F and/or reactive diluent G. The invention also relates to the use of said compositions as a single-component adhesive and to a method for producing the compositions. The invention further relates to the use of the thixotropic agent C, based on a urea derivative in a non-diffusing support material as an agent for increasing the impact resistance.
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