Method and apparatus for fluid processing a workpiece
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United States of America Patent
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Issued Date -
Aug 4, 2005
app pub date -
Oct 22, 2004
filing date -
Oct 22, 2003
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method and apparatus for fluid processing a workpiece are described. The system can include a process module and a system of one or more fluid processing elements to control the fluid flow and/or the electric field distribution during the fluid processing of the workpiece. A member can be used to agitate the fluid during deposition of a film (e.g., using an oscillatory motion). A plate can be used to shape an electric field incident on a surface of a workpiece. By controlling the fluid flow and the electric field distribution, improved deposition of the film on the workpiece surface can result. Furthermore, a vertical configuration and/or a modular architecture can be employed to improve throughput, increase productivity, and reduce cost.
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