Apparatus and method for processing wafers
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United States of America Patent
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Jun 20, 2006
Issued Date -
N/A
app pub date -
Jan 31, 2005
filing date -
Jul 31, 2002
priority date (Note) -
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Abstract
An apparatus for processing semiconductor wafers includes: a wafer support with a first positioning system that can rotate the wafer support coaxially with a wafer; at least one processing apparatus, which can be moved with a second positioning system such that a processing tool proceeding from the processing apparatus can be guided radially over the wafer; and at least one position determining apparatus for determining a wafer position on the basis of features of the wafer. Alignment marks of the wafer are found and points to be processed, such as laser fuses, are moved by rotation of the wafer and movement of at least one processing apparatus in the radial direction above the wafer.
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