Dies bonding apparatus and dies bonding method
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United States of America Patent
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Issued Date -
Aug 11, 2005
app pub date -
Jul 16, 2004
filing date -
Feb 5, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A dies bonding apparatus is provided with a nozzle unit for supplying an adhesive agent to a rectangular bonding area of a chip mounting surface. The nozzle unit includes a central nozzle for discharging an adhesive agent to the center of the bonding area, and a plurality of peripheral nozzles provided around the central nozzle and whose amount of discharge of the adhesive agent is smaller than the amount of discharge of the adhesive agent from the central nozzle.
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