Method for examining the structure of through-holes of a component
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United States of America Patent
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Jul 11, 2006
Grant Date -
Aug 11, 2005
app pub date -
Sep 12, 2003
filing date -
Nov 4, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Methods for examining through holes of a component according to prior art generally use hot gases for the thermographic detection of blockages. The inventive method for examining the structure of through holes of a component considerably simplifies said techniques, using a medium which has at least one absorption edge in the region of the wavelength of the camera and thus appears opaque in the camera image.
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