Importance

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Abstract

A method of manufacturing a thin, small-sized, inexpensive, non-leaded, resin-sealed type semiconductor device is disclosed. A flexible tape having plural terminals peelably through a first adhesive in a product forming portion formed on a main surface of the tape is provided, a semiconductor element is fixed to the main surface of the tape peelably through a second adhesive, electrodes formed on the semiconductor element and the terminals are connected together through conductive wires, an insulating resin layer is formed in an area including the semiconductor element and the wires on the main surface of the tape to cover the semiconductor element and the wires, and the tape on a back surface of the insulating resin layer is peeled, allowing the terminals to be exposed to the back surface of the insulating resin layer. Exposed surfaces of the terminals are each formed by a gold layer. The terminals each comprise a main metal layer of copper foil and one or plural auxiliary metal layers formed on each of a main surface and a back surface of the main metal layer. The auxiliary metal layer(s) on the main surface of the main metal layer is (are) formed using a material which affords a rough surface, thereby roughening the main surface side of each terminal.

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First Claim