Method for structuring metal by means of a carbon mask
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United States of America Patent
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app pub date -
Jan 6, 2005
filing date -
Jul 11, 2002
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Abandoned
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Abstract
A method for structuring metal is disclosed. At least one corrosion-intensive metal layer is deposited on an Si substrate by means of deposition method. An etching mask is then produced on the corrosion-intensive metal layer by photolithographic patterning processes using a resist. The metal layer can then be patterned through the etching mask by means of etching, preferably by plasma etching.
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