Laser shock peening of medical devices
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United States of America Patent
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-
Nov 1, 2011
Grant Date -
Aug 18, 2005
app pub date -
Feb 13, 2004
filing date -
Feb 13, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A laser shock peening process for producing one or more compressive residual stress regions in a medical device is disclosed. A high-energy laser apparatus can be utilized to direct an intense laser beam through a confining medium and onto the target surface of a workpiece. An absorption overlay disposed on the target surface of the workpiece absorbs the laser beam, inducing a pressure shock wave that forms a compressive residual stress region deep within the workpiece. Medical devices such as stents and guidewires having one or more of these compressive residual stress regions are also disclosed.
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