Printed circuit board substrate and method for constructing same
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United States of America Patent
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May 27, 2008
Grant Date -
Aug 25, 2005
app pub date -
Feb 19, 2004
filing date -
Feb 19, 2004
priority date (Note) -
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status (Latency Note)
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Abstract
A printed circuit board (PCB) substrate and method for construction of the same. In one embodiment, a first dielectric material is associated with a first current return layer and a second dielectric material is associated with a second current return layer. A signal path layer is interposed between the first dielectric material and the second dielectric material. An adhesive layer is interposed between the first dielectric material and the second dielectric material such that the adhesive layer is substantially coplanar relative to the signal path layer.
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