Substrate for carrying a semiconductor chip and a manufacturing method thereof

United States of America Patent

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Issued Date
Aug 25, 2005
app pub date
Apr 22, 2005
filing date
Oct 29, 2002

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Abandoned

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Abstract

A substrate includes a plurality of insulation layers forming a laminated structure and a built-in capacitor formed in the laminated structure, wherein the laminated structure includes a layer of baked organic polysilane.

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Patent Owner	Address
OOI KIYOSHI	Not Provided

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Inventor Name	Address	# of filed Patents	Total Citations
Horikawa, Yasuyoshi	Nagano, JP	37	445
Ooi, Kiyoshi	Nagano, JP	14	182

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Substrate for carrying a semiconductor chip and a manufacturing method thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

11112343

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APP PUB NO	20050185382A1
SERIAL NO	11112343
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11112343

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