Formation of CIGS absorber layer materials using atomic layer deposition and high throughput surface treatment

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United States of America Patent

PATENT NO 7858151
APP PUB NO 20050186342A1
SERIAL NO

10943658

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Abstract

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An absorber layer may be formed on a substrate using atomic layer deposition reactions. An absorber layer containing elements of groups IB, IIIA and VIA may be formed by placing a substrate in a treatment chamber and performing atomic layer deposition of a group IB element and/or one or more group IIIA elements from separate sources onto a substrate to form a film. A group VIA element is then incorporated into the film and annealed to form the absorber layer. The absorber layer may be greater than about 25 nm thick. The substrate may be coiled into one or more coils in such a way that adjacent turns of the coils do not touch one another. The coiled substrate may be placed in a treatment chamber where substantially an entire surface of the one or more coiled substrates may be treated by an atomic layer deposition process. One or more group IB elements and/or one or more group IIIA elements may be deposited onto the substrate in a stoichiometrically controlled ratio by atomic layer deposition using one or more self limiting reactions.

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Patent Owner(s)

Patent OwnerAddress
AERIS CAPITAL SUSTAINABLE IP LTDP O BOX 715 C/O AVALON MANAGEMENT LIMITED LANDMARK SQUARE 1ST FLOOR 64 EARTH CLOSE GRAND CAYMAN KY1-1107

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Leidholm, Craig Sunnyvale, US 47 1116
Roscheisen, Martin R San Francisco, US 54 2717
Sager, Brian M Menlo Park, US 66 3478

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