Z-pin closeout joint and method of assembly
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United States of America Patent
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N/A
Issued Date -
Aug 25, 2005
app pub date -
Apr 1, 2005
filing date -
Aug 5, 2002
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method uses a three-dimensional, adhesive-infused, woven preform to assemble two components, each component having z-pins extending from bonding surfaces. The components and preform are assembled with surfaces of the preform contacting surfaces of the components, the z-pins penetrating into the preform. The perform is equal or slightly greater in thickness than the protrusion lengths of the z-pins. The adhesive in the preform is then cured, adhering the preform to the components and retaining the z-pins within the preform.
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Family
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Cited Art Landscape
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