Fluidic apparatus and method for cooling a non-uniformly heated power device
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United States of America Patent
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Issued Date -
Sep 1, 2005
app pub date -
Feb 27, 2004
filing date -
Feb 27, 2004
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A fluidic apparatus and method for cooling a non-uniformly heated heat source such as an integrated circuit. The apparatus preferentially cools a non-uniformly heated integrated circuit. A coolant is introduced into a high-power region of the integrated circuit through an inlet. The coolant absorbs heat from this region and cools it. Thereafter, the coolant is transferred to the low-power region of the integrated circuit. After the coolant absorbs heat from the low-power region, it is removed from an outlet, which is connected to the low-power region of the integrated circuit.
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