Method and apparatus for semiconductor processing
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United States of America Patent
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Issued Date -
Sep 8, 2005
app pub date -
Aug 27, 2004
filing date -
Aug 29, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method and apparatus for semiconductor processing is disclosed. In one embodiment, a method of transporting a wafer within a cluster tool, comprises placing the wafer into a first segment of a vacuum enclosure, the vacuum enclosure being attached to a processing chamber and a factory interface. The wafer is transported to a second segment of the vacuum enclosure using a vertical transport mechanism, wherein the second segment is above or below the first segment.
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