Electrochemical fabrication methods incorporating dielectric materials and/or using dielectric substrates

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20050194258A1
SERIAL NO

11029179

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

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Patent Owner(s)

Patent OwnerAddressTotal Patents
MICROFABRICA INC.VAN NUYS, CA82

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cohen, Adam L Los Angeles, CA 236 2663
Frodis, Uri Los Angeles, CA 41 480
Kim, Kieun Pasadena, CA 49 265
Le, Qui T Anaheim, CA 15 144
Lockard, Michael S Lake Elizabeth, CA 137 1710
McPherson, Dale S Kissimmee, FL 13 126
Smalley, Dennis R Newhall, CA 177 4416
Zhang, Gang Monterey Park, CA 114 906

Cited Art Landscape

Patent Info (Count) # Cites Year
 
MICROFABRICA INC. (3)
* 7259640 Miniature RF and microwave components and methods for fabricating such components 48 2002
* 7239219 Miniature RF and microwave components and methods for fabricating such components 51 2003
* 2005/0032,375 Methods for electrochemically fabricating structures using adhered masks, incorporating dielectric sheets, and/or seed layers that are partially removed via planarization 16 2004
 
INTEL CORPORATION (1)
* 2003/0077,871 Fabrication of on-package and on-chip structure using build-up layer process 10 2002
 
WISCONSIN ALUMNI RESEARCH FOUNDATION (1)
* 5190637 Formation of microstructures by multiple level deep X-ray lithography with sacrificial metal layers 174 1992
 
MOTOROLA SOLUTIONS, INC. (1)
* 6008102 Method of forming a three-dimensional integrated inductor 220 1998
 
UNIVERSITY OF SOUTHERN CALIFORNIA (1)
* 6027630 Method for electrochemical fabrication 202 1998
* Cited By Examiner

Patent Citation Ranking

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Patent Info (Count) # Cites Year
 
VIRGIN ISLAND MICROSYSTEMS, INC. (1)
7208712 Structures and methods for coupling energy from an electromagnetic wave 0 2005
 
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7791290 Ultra-small resonating charged particle beam modulator 1 2005
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7361916 Coupled nano-resonating energy emitting structures 14 2005
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7714513 Electron beam induced resonance 6 2006
7558490 Resonant detector for optical signals 3 2006
7876793 Micro free electron laser (FEL) 4 2006
7646991 Selectable frequency EMR emitter 4 2006
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7492868 Source of x-rays 0 2006
7443358 Integrated filter in antenna-based detector 38 2006
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8188431 Integration of vacuum microelectronic device with integrated circuit 0 2006
7986113 Selectable frequency light emitter 1 2006
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7758739 Methods of producing structures for electron beam induced resonance using plating and/or etching 0 2006
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7573045 Plasmon wave propagation devices and methods 14 2007
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FMI TECHNOLOGIES, INC. (1)
7655934 Data on light bulb 1 2006
* Cited By Examiner