Process for treating a conductive surface and products formed thereby
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United States of America Patent
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Issued Date -
Sep 8, 2005
app pub date -
Apr 26, 2005
filing date -
Aug 3, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The disclosure relates to a process for forming a deposit on the surface of a metallic or conductive surface. The process employs an electrolytic process to deposit a silicate containing coating or film upon a metallic or conductive surface.
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