Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same
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United States of America Patent
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Feb 24, 2009
Grant Date -
Sep 8, 2005
app pub date -
Mar 3, 2005
filing date -
Mar 4, 2004
priority date (Note) -
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Abstract
for electrical connection are provided in a grid pattern in a region inside the first external terminal portions and exposed on a lower surface of the encapsulating resin. A plurality of semiconductor elements or coils and resistors can be incorporated, and further semiconductor devices can be stacked.
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