Heat transfer system for a mold
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United States of America Patent
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N/A
Issued Date -
Sep 8, 2005
app pub date -
Jan 13, 2005
filing date -
Jan 13, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An apparatus for facilitating heat transfer in a mold is disclosed. The apparatus includes a mold section having an external surface defining a concave-shaped channel, a hollow elongated member positioned within the channel, and a binding material attaching the hollow elongated member to the mold section. Heat transfers from the mold section to relatively cooler heat transfer fluid when the fluid is directed through the hollow elongated member. Heat may also transfer from the molded piece to the mold section when the fluid is transported through the hollow elongated member. The apparatus may have any number of channels and members. The hollow elongated member may be a copper tube and be completely or partially positioned within the channel. The mold section and binding material may be made of aluminum. A method of manufacture of the apparatus is also disclosed.
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