Modular device assembly incorporating electronics therein
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Sep 15, 2005
app pub date -
Jan 6, 2005
filing date -
Mar 11, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A molded assembly includes a device having at least two states and a control having a lead or a contact. The control is adapted to actuate the device between the at least two states. A plastic body is molded about the control and is either molded about the device or forms the device. The control is at least partially encapsulated in the body, and the lead or contact for coupling to an external power supply for powering the control and the device.
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