Semiconductor device, semiconductor package, and method for testing semiconductor device
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United States of America Patent
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Dec 20, 2011
Grant Date -
Sep 15, 2005
app pub date -
May 9, 2005
filing date -
Jun 27, 2002
priority date (Note) -
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Abstract
A semiconductor device designed to facilitate testing. Superimposed first and second semiconductor chips each include a plurality of internal terminals, an external terminal, and a plurality of transistors. A plurality of wires connect the internal terminals, the transistors, and the external terminals of the first and second semiconductor chips in series.
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