Method and apparatus for molding a composite modular tile with edge interlocks
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United States of America Patent
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N/A
Issued Date -
Sep 15, 2005
app pub date -
Mar 9, 2004
filing date -
Mar 9, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method and apparatus for producing a tile that includes a preformed plastic lamina thermally bonded to a planar plastic tile substrate. The tile has edge interlock elements formed thereon. The thermal bonding is accomplished during an injection molding process utilized to mold the substrate. Placement of the lamina in the apparatus for thermal bonding is controlled by a robotic arm.
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Cited Art Landscape
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