Continuous lamination of RFID tags and inlets
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United States of America Patent
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app pub date -
May 10, 2005
filing date -
Mar 24, 2003
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A process for continuous lamination of radio frequency identification (RFID) tags includes providing a continuous source of RFID inlets. The RFID inlets are dispensed between top and bottom substrates of web material which are attached to each other to create a continuous multi-layer substrate which is then formed into a dispensing configuration.
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