Sputtering device for manufacturing thin films
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United States of America Patent
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N/A
Issued Date -
Sep 22, 2005
app pub date -
Mar 21, 2005
filing date -
Mar 22, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A sputtering station for depositing a thin film on a substrate includes a cathode comprising two targets placed opposite each other defining a plasma region, permanent magnets or coils to generate a magnetic field, yokes to direct the magnetic field and two independent power supplies connected to each target to independently control the energy to each target.
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