Die package with higher useable die contact pad area
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United States of America Patent
Stats
-
N/A
Issued Date -
Sep 22, 2005
app pub date -
Jul 19, 2004
filing date -
Mar 19, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A die package is provided including a circuit board with a recess for a die mounting area. A cap receiving area is located in the circuit board at least partially around the recess for the die mounting area. A cap located in the cap receiving area includes resilient contacts corresponding to at least some contact pad locations on one of a die or a secondary circuit board affixed to die to establish contact between the resilient contacts on the cap and the contact pad locations. A die for use with the die package can include contact pads in the heretofore unused center area of the die, as well as the typical peripheral contact pads, allowing more IO connections, more efficient connections and greater contact pad areas.
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