Method for analyzing impurities
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Sep 22, 2005
app pub date -
Mar 16, 2005
filing date -
Mar 19, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The impurity analyzing method is for analyzing impurities that exist on a surface of a semiconductor wafer, which includes a step of bubbling a mixed solution including hydrofluoric acid and aqueous hydrogen peroxide or a mixed solution including hydrofluoric acid and aqueous ozone to generate a vapor including hydrofluoric acid and aqueous hydrogen peroxide or a vapor including hydrofluoric acid and aqueous ozone, a step of dissolving a film formed on the surface of the semiconductor wafer by means of the vapor including hydrofluoric acid and aqueous hydrogen peroxide or the vapor including hydrofluoric acid and aqueous ozone, a step of supplying liquid drops onto the surface of the semiconductor wafer and collecting the impurities along with the liquid drops, and a step of analyzing the collected impurities.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully