Die to substrate attach using printed adhesive
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Sep 22, 2005
app pub date -
Oct 15, 2004
filing date -
Mar 19, 2004
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A semiconductor chip packaging method (34) includes printing an adhesive (46) on a support surface (42), typically a surface of a semiconductor substrate (44), to create individual adhesive areas (40). Semiconductor chips (24) are individually placed on the individual adhesive areas thereby securing the semiconductor chips to the support surface to create first chip subassemblies (55). The semiconductor chip and the semiconductor substrate are electrically connected to create second chip subassemblies (62). At least a portion of each of at least some of the second chip subassemblies is encapsulated to create semiconductor chip packages (64). The adhesive at the individual adhesive areas is preferably a B-staged adhesive so that solvent is removed from the adhesive before the individually placing step.
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