Copper alloy and copper alloy manufacturing method

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United States of America Patent

SERIAL NO

11084692

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Abstract

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An object of the present invention is to provide copper alloy which has a dimensionless performance index value M satisfying an inequality: M>400 in either a binary system alloy composition containing Cu and Zr, or a ternary system alloy composition containing Cu, Zr, and B. In the copper alloy of the present invention, a composition by atomic percent is expressed by a composition formula: Cu.sub.100-(a+b)Zr.sub.aB.-sub.b, and a dual phase structure having a layered structure including a plurality of Cu matrices constituted by grain particles and an eutectic phase constituted by the Cu matrix and any of a Cu--Zr compound and a Cu--Zr--B compound is constituted. Part of each of the grain particles contacts other grain particles, and the 'a', the 'b', and the '(a+b)' satisfy 0.05.ltoreq.a.ltoreq.8.0, 0.ltoreq.b.ltoreq.4.0, and a+b.ltoreq.8.0.

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Patent Owner(s)

Patent OwnerAddress
NGK INSULATORS LTDNAGOYA-SHI AICHI 467-8530
INOUE AKIHISA5-3-1-2807 NAGAMACHI TAIHAKU-KU SENDAI-CITY MIYAGI-KEN 982-0011

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kimura, Hisamichi Miyagi-ken, JP 31 264
Muramatsu, Naokuni Nagoya-shi, JP 42 208
Suzuki, Ken Handa-shi, JP 97 1306

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