Integrated circuit heat pipe heat spreader with through mounting holes
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
N/A
Issued Date -
Oct 6, 2005
app pub date -
May 13, 2005
filing date -
May 12, 1999
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A heat pipe with superior heat transfer between the heat pipe and the heat source and heat sink is provided. The heat pipe is held tightly against the heat source by mounting holes which penetrate the structure of the heat pipe but are sealed off from the vapor chamber because they each are located within a sealed structure such as a pillar or the solid layers of the casing surrounding the vapor chamber. Another feature of the heat pipe is the use of a plurality of particles joined together by a brazing compound such that fillets of the brazing compound are formed between adjacent ones of the plurality of particles so as to form a network of capillary passageways between the particles of the wick.
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