Magnetron sputtering source and chamber therefor
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Oct 6, 2005
app pub date -
May 31, 2005
filing date -
Feb 4, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A magnetron sputtering source with a target having a surface to be sputtered, has a magnet arrangement for generating on the surface a magnetron magnetic field pattern, so as to generate on the surface to be sputtered an outer erosion profile along a substantially circular locus and an inner erosion profile within the outer erosion profile. The surface consists of a material with at least two elements of different weight and the magnet arrangement is adapted to form the inner erosion profile three-dimensionally cup-shaped.
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