Material separation to form segmented product
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United States of America Patent
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app pub date -
Jun 13, 2005
filing date -
Apr 9, 2003
priority date (Note) -
Abandoned
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Abstract
A method of removing selected portions of material from a base material using a plurality of different depth cuts (e.g., using laser cutting) such that apertured sections (or segments) are expeditiously removed for eventual use with another component or otherwise. In one example, the segmented section so removed can be used to bond various elements of an electronic package which in turn can then be positioned and used within an information handling system such as a computer, server, mainframe, etc.
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