Wireless substrate-like sensor

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United States of America Patent

SERIAL NO

11075357

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Abstract

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In accordance with an aspect of the present invention, a wireless substrate-like sensor is configured to ensure it does not contaminate a semiconductor processing chamber. The sensor is sealed except for one or more apertures. In one embodiment, a vent is disposed proximate the apertures. In another embodiment, the aperture is coupled to a pressure equalization member that deforms in response to a differential in pressure between the sensor interior and exterior.

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Patent Owner(s)

Patent OwnerAddress
CYBEROPTICS SEMICONDUCTOR INC13555 S W MILLIKAN WAY BEAVERTON OR 97005

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gardner, DelRae H Tualatin, OR 13 211
Lassahn, Jeffrey K Portland, OR 14 103
Ramsey, Craig C West Linn, OR 12 171

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