Importance

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Abstract

A semiconductor spacer structure comprises in order a backgrinding tape layer, a spacer adhesive layer, a semiconductor spacer layer, a dicing tape layer. A second spacer adhesive layer may be used between the semiconductor spacer layer and the dicing tape layer. In a method for attaching a semiconductor spacer die to a support surface, a first subassembly, comprising a spacer wafer having first and second sides, a backgrinding tape layer and a spacer adhesive layer between the first side and the backgrinding tape layer, is obtained. The second side of the spacer wafer is background to create a second subassembly, which is secured to a dicing tape with the backgrinding tape layer exposed. The backgrinding tape is removed from the spacer adhesive layer and the resulting structure is diced to create spacer/adhesive die structures comprising spacer die and adhesive. A spacer/adhesive die structure is secured to a support surface with the adhesive exposed. A second spacer adhesive layer may be adhered to the second side of the spacer wafer after backgrinding step for securing the resulting adhesive/spacer/adhesive die structure to the support surface.

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First Claim