Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Mar 26, 2013
Grant Date -
Oct 13, 2005
app pub date -
Apr 2, 2004
filing date -
Apr 2, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
Organic electronic packages having sealed edges. More specifically, packages having organic electronic devices are provided. A number of sealing mechanisms are provided to hermetically seal the edges of the package to completely protect the organic electronic device from external elements. A sealant may be implemented to completely surround the organic electronic device. Alternatively, edge wraps may be provided to completely surround the organic electronic device.
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