Semiconductor device with a plurality of ground planes
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United States of America Patent
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Issued Date -
Oct 13, 2005
app pub date -
Mar 26, 2004
filing date -
Mar 26, 2004
priority date (Note) -
Abandoned
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Abstract
A multi-chip module (MCM) with a plurality of ground planes/layers is provided. Each integrated circuit (IC) chip of the MCM has its own ground plane on a substrate in the MCM. This MCM structure may facilitate separate testing of each IC chip without affecting other chips and without being affected by other chips. This MCM structure also may facilitate testing of interconnects/connections between two or more chips.
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