Semiconductor device package having buffered memory module and method thereof
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United States of America Patent
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Oct 26, 2010
Grant Date -
Oct 13, 2005
app pub date -
Jan 13, 2005
filing date -
Apr 8, 2004
priority date (Note) -
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Abstract
A method and apparatus of fabricating a semiconductor device are disclosed. The semiconductor device may include a buffer chip package having a buffer chip mounted on a buffer chip substrate and at least one memory package mounted on the buffer chip substrate, wherein the at least one memory package may include a plurality of memory chips. Further, the buffer chip package may have a plurality of external connection terminals.
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