VIA configurable architecture for customization of analog circuitry in a semiconductor device
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United States of America Patent
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Nov 11, 2008
Grant Date -
Oct 13, 2005
app pub date -
Apr 1, 2005
filing date -
Apr 2, 2004
priority date (Note) -
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Abstract
A semiconductor device having a plurality of layers and a plurality of circuit elements arranged in tiles. At least one of the plurality of layers in the semiconductor device may be a via layer configured to determine the connections of the plurality of circuit elements. The semiconductor device may include an interconnection quilt having a plurality of metal layers disposed to interconnect the plurality of circuit elements. The plurality of circuit elements may be analog circuit element and/or digital circuit elements. The tiles may be analog tiles and digital tiles that form a mixed signal structured array.
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